COMMANDO 10GBASE-SR, SFP+, 850nm, 300m, MMF, DOM, Compatible w/ Meraki MA-SFP-10GB-SR









  • CMD-10GB-SR SFP+ Transceiver Module
  • Cabling Type: 10GBASE-SR, MMF
  • Data Transfer Rate: 10.3125Gbps
  • Connective Media: LC duplex
  • Distance Support: 300m over OM3 MMF
  • DOM Support: Yes
  • Form Factor: SFP (Small Form Factor Pluggable) MSA & ROHS Compliant

Small Form-Factor Plus Pluggable Transceiver

The enhanced small form-factor pluggable (SFP+) is an enhanced version of the SFP that supports data rates up to 16 Gbit/s.
Although the SFP+ standard does not include mention of 16G Fibre Channel it can be used at this speed.
SFP+ supports 8 Gbit/s Fibre Channel, 10 Gigabit Ethernet and Optical Transport Network standard OTU2. It is a popular industry format supported by many network component vendors.
10 Gbit/s SFP+ modules are exactly the same dimensions as regular SFPs, allowing the equipment manufacturer to re-use existing physical designs for 24 and 48-port switches and modular linecards.

Short Reach SR

SR or Short Reach transceivers can transmit 10Gbps of data up to 300 m over multi-mode duplex fiber. Standard wavelength for SR transceivers is 850 nm.

Digital Optical Monitoring (DOM)

DOM, short for Digital optical monitoring, is familiar with the DDM function. It is also a feature which allows you to monitor many parameters of the transceiver module in real-time. DOM allows you to monitor the TX (transmit) and RX (receive) of the module, as well as input/output power, temperature, and voltage. Network administrators can then check and ensure that the module is functioning correctly

Vendor Part Code MA-SFP-10GB-SR COMMANDO Part Code CMD-10GB-SR
Form Type SFP+ Wavelength 850nm
Interface LC duplex Cable Type MMF
TX Power -7.3~-1dBm Industrial Temperature Range -40 to 85°C (-40 to 185°F)
Max Data Rate 10.3125Gbps Max Cable Distance 300m over OM3 MMF
Optical Components VCSEL 850nm DOM Support Yes
Receiver Sensitivity < -11.1dBm HTS-Harmonized Code 8517706000

High Quality Components

High Quality Laser, IC and other Components

Advance Multi-Process for Manufacturing to ensure High Quality, Stable and Best Performing COMMANDO Products.

Manufacturing Process

  • Assembling: Component Assembling, Trim Pinning, Device Welding, Component Integration
  • Testing: Performance Testing, Parameter Adjustment, Final Setting
  • Aging: High Temperature, Aging (85℃)
  • Final Testing: Comprehensive Performance Testing, Final High and Low Temperature Measurement, Interface Testing, Transmission Testing, Appearance Inspection
  • Packaging: Information Accuracy, Labeling, Retail, Wholesale Packaging

Comprehensive Product Testing


Transmission distance

Band Calibration

Software/Coded Information

Microscopic Inspection

Box Packaging

Single Modules Packaging

10 Industrial Boxes(Default)

Carton Cartoon Packaging

Sr.No. Image Part Code Description