CMD-4860C

COMMANDO GBIC-LH, SFP, 1550nm, 80km, SMF, DOM, Compatible w/ HP J4860C

Transceivers

Mini-GBIC

SFP

SFP+

10G

GPON

EPON

Features

  • CMD-4860C SFP Transceiver Module
  • Cabling Type: GBIC-LH, SMF
  • Data Transfer Rate: 1000Mbps
  • Connective Media: LC duplex
  • Distance Support: 80km
  • DOM Support: Yes
  • Form Factor: SFP (Small Form Factor Pluggable) MSA & ROHS Compliant

Small Form-Factor Pluggable Transceiver

SFP Is a compact, hot-pluggable optical module transceiver used for both telecommunication and data communications applications. The form factor and electrical interface are specified by a multi-source agreement (MSA) under the auspices of the Small Form Factor Committee. SFP transceivers are available with a variety of transmitter and receiver types, allowing users to select the appropriate transceiver for each link to provide the required optical reach over the available optical fiber type (e.g. multi-mode fiber or single-mode fiber). Transceivers are most often designated by the standard transmission speed on the medium (e.g. 1.25 Gbit/s), but sometimes they are labeled with their nominal Ethernet speed or a higher speed the manufacturer specifies.

Digital Optical Monitoring (DOM)

DOM, short for Digital optical monitoring, is familiar with the DDM function. It is also a feature which allows you to monitor many parameters of the transceiver module in real-time. DOM allows you to monitor the TX (transmit) and RX (receive) of the module, as well as input/output power, temperature, and voltage. Network administrators can then check and ensure that the module is functioning correctly

Vendor Part Code J4860C COMMANDO Part Code CMD-4860C
Form Type SFP Wavelength 1550nm
Interface LC duplex Cable Type SMF
TX Power -2~3dBm Commercial Temperature Range 0 to 70°C (32 to 158°F)
Max Data Rate 1000Mbps Max Cable Distance 80km*
Optical Components DFB 1550nm DOM Support No
Receiver Sensitivity < -24dBm HTS-Harmonized Code 8517706000

High Quality Components

High Quality Laser, IC and other Components

Advance Multi-Process for Manufacturing to ensure High Quality, Stable and Best Performing COMMANDO Products.

Manufacturing Process


  • Assembling: Component Assembling, Trim Pinning, Device Welding, Component Integration
  • Testing: Performance Testing, Parameter Adjustment, Final Setting
  • Aging: High Temperature, Aging (85℃)
  • Final Testing: Comprehensive Performance Testing, Final High and Low Temperature Measurement, Interface Testing, Transmission Testing, Appearance Inspection
  • Packaging: Information Accuracy, Labeling, Retail, Wholesale Packaging

Comprehensive Product Testing

Compatibility

Transmission distance

Band Calibration

Software/Coded Information

Microscopic Inspection

Box Packaging

Single Modules Packaging

10 Industrial Boxes(Default)

Carton Cartoon Packaging

Sr.No. Image Part Code Description

Awards

Certification